DocumentCode :
1229604
Title :
Electro-Compatibility Features of Microelectronics
Author :
Schulz, R.B. ; Clapsaddle, R.L.
Author_Institution :
Airplane Division, The Boeing Company
Volume :
2
Issue :
2
fYear :
1964
fDate :
4/1/1964 12:00:00 AM
Firstpage :
483
Lastpage :
490
Abstract :
This paper considers theoretically the effects (relative to conventional design) of micro-miniaturization on the mutual compatibility among various portions of systems. It discusses the major factors involved, such as power levels, sizes of radiators and pickups, spacings among them, and function trends toward solid-state switching and greater use of digital operations. From these, compatibility relationships are developed and the relative severity of the compatibility problem is estimated.
Keywords :
Aerospace materials; Ceramics; Conductive films; Consumer electronics; Costs; Inductance; Integrated circuit interconnections; Microelectronics; Sputtering; Thin film circuits;
fLanguage :
English
Journal_Title :
Aerospace, IEEE Transactions on
Publisher :
ieee
ISSN :
0536-1516
Type :
jour
DOI :
10.1109/TA.1964.4319628
Filename :
4319628
Link To Document :
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