Title :
Electro-Compatibility Features of Microelectronics
Author :
Schulz, R.B. ; Clapsaddle, R.L.
Author_Institution :
Airplane Division, The Boeing Company
fDate :
4/1/1964 12:00:00 AM
Abstract :
This paper considers theoretically the effects (relative to conventional design) of micro-miniaturization on the mutual compatibility among various portions of systems. It discusses the major factors involved, such as power levels, sizes of radiators and pickups, spacings among them, and function trends toward solid-state switching and greater use of digital operations. From these, compatibility relationships are developed and the relative severity of the compatibility problem is estimated.
Keywords :
Aerospace materials; Ceramics; Conductive films; Consumer electronics; Costs; Inductance; Integrated circuit interconnections; Microelectronics; Sputtering; Thin film circuits;
Journal_Title :
Aerospace, IEEE Transactions on
DOI :
10.1109/TA.1964.4319628