DocumentCode :
1229650
Title :
Mitigation Techniques for Single-Event-Induced Charge Sharing in a 90-nm Bulk CMOS Process
Author :
Amusan, Oluwole A. ; Massengill, Lloyd W. ; Baze, Mark P. ; Bhuva, Bharat L. ; Witulski, Arthur F. ; Black, Jeffrey D. ; Balasubramanian, Anupama ; Casey, Megan C. ; Black, Dolores A. ; Ahlbin, Jonathan R. ; Reed, Robert A. ; McCurdy, Michael W.
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN
Volume :
9
Issue :
2
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
311
Lastpage :
317
Abstract :
In this paper, mitigation techniques to reduce the increased SEU cross section associated with charge sharing in a 90-nm dual-interlocked-cell latch are proposed. The increased error cross section is caused by heavy-ion angular strikes depending on the direction of the ion strike, thereby exacerbating charge sharing among multiple circuit nodes. The use of nodal spacing as a mitigation technique shows an order of magnitude decrease on upset cross section as compared to a conventional layout, and the use of guard-rings show no noticeable effect on upset cross section.
Keywords :
CMOS integrated circuits; integrated circuit design; ion beam effects; radiation hardening (electronics); SEU cross section; bulk CMOS process; dual-interlocked-cell latch; heavy-ion angular strike direction; mitigation technique; multiple circuit nodes; nodal spacing; single-event-induced charge sharing; size 90 nm; Charge sharing; dual-interlocked-cell (DICE) latch; guard-rings; heavy ion; nodal spacing; single-event (SE) circuit characterization; soft-error cross section;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2009.2019963
Filename :
4812109
Link To Document :
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