DocumentCode
123013
Title
Table of contents
fYear
2014
fDate
3-5 March 2014
Firstpage
1
Lastpage
8
Abstract
The following topics are dealt with: memory circuits; system-level analysis; multicore systems; SoC verification; electronic package; 3D integration; nanoscale CMOS; low power design methodologies; reliability; aging; circuit design; power grid analysis; and smart sensors design technology.
Keywords
CMOS integrated circuits; ageing; electronics packaging; integrated circuit design; intelligent sensors; low-power electronics; microprocessor chips; multiprocessing systems; reliability; system-on-chip; 3D integration; SoC verification; aging; circuit design; electronic package; low power design methodologies; memory circuits; multicore systems; nanoscale CMOS; power grid analysis; reliability; smart sensors design technology; system-level analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2014 15th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-3945-9
Type
conf
DOI
10.1109/ISQED.2014.6783298
Filename
6783298
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