Title :
Integrated Circuit Hybrid, and Multichip Module Package Design Guidelines [Books and Reports]
fDate :
1/1/1995 12:00:00 AM
Keywords :
Electronic switching systems; Guidelines; Hybrid integrated circuits; Integrated circuit packaging; Lead; Material storage; Multichip modules; Power engineering and energy; Pulp manufacturing; Thermal management;
Journal_Title :
Power Engineering Review, IEEE
DOI :
10.1109/MPER.1995.350451
