• DocumentCode
    123072
  • Title

    Automated Shmoo data analysis: A machine learning approach

  • Author

    Wei Wang

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2014
  • fDate
    3-5 March 2014
  • Firstpage
    212
  • Lastpage
    218
  • Abstract
    In silicon testing, a Shmoo plot is commonly used to give us an insight into the silicon manufacturing development health. Shmoo plots and other silicon characterization data has high value, however, analysis of them is a time-consuming work. This paper establishes a machine learning based model to improve and automate the procedure in silicon data analysis for HVM test content development. Our experiment shows that the supervised learning model has good accuracy on VMIN estimation across various kinds of Shmoo issues (crack/sprinkle/ceiling). The accuracy attained is greatly improved over previous tools. The framework can be easily integrated into any automated tester software and would save time to market during first silicon characterization. Additionally, the methodology discussed in this work can be extended to the HVM test flow for silicon behavior.
  • Keywords
    electronic engineering computing; elemental semiconductors; learning (artificial intelligence); semiconductor device manufacture; semiconductor device testing; silicon; HVM test content development; HVM test flow; Shmoo plot; VMIN estimation; automated Shmoo data analysis; automated tester software; machine learning approach; silicon characterization; silicon characterization data; silicon data analysis; silicon manufacturing development health; silicon testing; supervised learning model; Accuracy; Algorithm design and analysis; Classification algorithms; Decision trees; Prediction algorithms; Silicon; Training; HVM; Machine Learning; Shmoo experiment; Silicon Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2014 15th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-3945-9
  • Type

    conf

  • DOI
    10.1109/ISQED.2014.6783327
  • Filename
    6783327