Title :
Integrated Circuit Inspection Via Acoustic Microscopy
Author :
Weglein, Rolf D.
Keywords :
Acoustic devices; Acoustic imaging; Acoustic reflection; Acoustic waves; Flip chip; Inspection; Optical films; Optical microscopy; Optical reflection; Sensor arrays;
Journal_Title :
Sonics and Ultrasonics, IEEE Transactions on
DOI :
10.1109/T-SU.1983.31381
