• DocumentCode
    123085
  • Title

    Sub-threshold custom standard cell library validation

  • Author

    Bo Liu ; Ashouei, M. ; Gemmeke, T. ; de Gyvez, Jose Pineda

  • Author_Institution
    Electron. Syst., Electr. Eng., Tech. Univ. Eindhoven, Eindhoven, Netherlands
  • fYear
    2014
  • fDate
    3-5 March 2014
  • Firstpage
    257
  • Lastpage
    262
  • Abstract
    Through silicon measurements of test chips designed based on two standard cell libraries in 40 nm, this paper shows that by proper current distribution balancing between NMOS and PMOS network, standard cells can be improved in terms of speed, power efficiency and variation resilience in sub-threshold region. Compared to the commercial library cells, combinational cells have 2× better speed at sub-threshold region and up to 60% less leakage power from sub-threshold to super-threshold region without any area penalty. Our Flipflops have 1.3× better propagation delay, and 40 mV lower first failure voltage. The simulation results of an in-house hardware accelerator further proves that based on sub-threshold custom cell library, the accelerator can achieve 2× faster speed, 46% less variation and 20% energy savings at 0.3 V.
  • Keywords
    MOS integrated circuits; elemental semiconductors; failure analysis; flip-flops; integrated circuit reliability; silicon; NMOS network; PMOS network; combinational cells; commercial library cells; current distribution balancing; failure voltage; flip flops; in-house hardware accelerator; power efficiency; propagation delay; subthreshold custom cell library; subthreshold custom standard cell library validation; subthreshold region; test chips; through silicon measurements; variation resilience; Flip-flops; Inverters; Libraries; Logic gates; Standards; Transistors; Tuning; Custom standard cell; leakage saving; standard cell library; sub-threshold; variation resilient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2014 15th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-3945-9
  • Type

    conf

  • DOI
    10.1109/ISQED.2014.6783334
  • Filename
    6783334