Title :
Temperature Compensation of Transducers Using Semiconductor Strain Gages
Author_Institution :
Micro Systems Incorporated Pasadena, California
fDate :
6/1/1965 12:00:00 AM
Abstract :
Temperature compensation of transducers using semiconductor strain gages involves an understanding of the interrelationships between basic sensor performance, transducer design and compensation techniques. This paper describes some of these interrelationships and gives specific information regarding conventional temperature compensation approaches used on production hardware.
Keywords :
Aerospace testing; Bridge circuits; Capacitive sensors; Electric resistance; Semiconductor device doping; Sensor phenomena and characterization; Sensor systems; Silicon; Temperature sensors; Transducers;
Journal_Title :
Aerospace, IEEE Transactions on
DOI :
10.1109/TA.1965.4319781
