• DocumentCode
    1231096
  • Title

    The fabrication of Ga1-xAlxAs-GaAs heterojunction bipolar transistors for rapid material analysis

  • Author

    Roedel, Ronald J. ; West, William ; Lee, Tart S. ; Davito, David ; Adams, Robert

  • Author_Institution
    Center for Solid State Electron. Res., Arizona State Univ., Tempe, AZ, USA
  • Volume
    8
  • Issue
    1
  • fYear
    1995
  • fDate
    2/1/1995 12:00:00 AM
  • Firstpage
    79
  • Lastpage
    83
  • Abstract
    We report a procedure for fabricating Ga1-xAlx As-GaAs heterojunction bipolar transistors with a single Al-Ge-Ni metallization step for rapid material analysis. Al-Ge-Ni produces an excellent ohmic contact to both n- and p-type GaAs, and eliminates the need for two metallization steps to produce the three transistor contacts. Complete transistor fabrication, which includes separate etching steps to the base and the subcollector, can be carried out in approximately four hours. We have used this rapid turnaround time to enhance wafer yield by minimizing the lag time between the onset of a growth problem or reactor hardware problem and subsequent growth runs
  • Keywords
    III-V semiconductors; aluminium compounds; etching; gallium arsenide; heterojunction bipolar transistors; semiconductor device metallisation; Al-Ge-Ni; Ga1-xAlxAs-GaAs HBT; GaAlAs-As; etching steps; fabrication; heterojunction bipolar transistors; ohmic contact; rapid material analysis; single Al-Ge-Ni metallization step; Doping; Epitaxial layers; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Inductors; Inorganic materials; Metallization; Ohmic contacts; Thickness measurement;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.350760
  • Filename
    350760