Title :
XFACT: a furnace analysis and characterization tool
Author :
de Gyvez, Jose Pineda
fDate :
2/1/1995 12:00:00 AM
Abstract :
The diffusion furnace is one the most important and complex process equipment in the process line and efforts towards characterizing it will be well worth the effort. A CAM package for wafer temperature map reconstruction using only a few sampled data points is proposed. The software is completely generic and has no affiliation to any make of furnace. The data required for simulation can easily be obtained from the actual piece of equipment. Interpolation techniques with high accuracy are used for developing the temperature contours inside the furnace using a modified version of the Lagrange´s interpolation technique
Keywords :
computer aided analysis; furnaces; integrated circuit manufacture; interpolation; production engineering computing; semiconductor process modelling; simulation; temperature distribution; thermal analysis; thermal diffusion; CAM package; IC production; VLSI manufacture; XFACT; diffusion furnace; furnace analysis tool; furnace characterization tool; interpolation techniques; process equipment; temperature contours; wafer temperature map reconstruction; CADCAM; Computer aided manufacturing; Furnaces; Interpolation; Lagrangian functions; Manufacturing processes; Packaging machines; Temperature distribution; Temperature measurement; Very large scale integration;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
