Title :
Study of IC aging on ring oscillator physical unclonable functions
Author :
Ganta, D. ; Nazhandali, Leyla
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Tech., Blacksburg, VA, USA
Abstract :
Silicon Physical Unclonable Functions (PUF) are novel circuits that exploit the random variations that exist in CMOS manufacturing process to generate chip-unique random bits. As their applications are security based, it is highly desired to have PUF responses that are very stable against the reliability issues that exist in Integrated Circuits (IC). One of the major sources of unreliability in the technology nodes 90nm and below is device aging. Aging is primarily due to phenomena like Bias Temperature Instability (BTI) and Hot Carrier Injection (HCI). In this work, we study the effect of device aging on the stability of Ring Oscillator PUFs for different PUF circuit-level choices and operating conditions. We observe that most of the PUF´s aging instability happens early in its lifetime. Due to the typical differential nature of PUF structures, stability does not change significantly with age. Further, a high correlation has been observed between instability that is caused due to aging and instability that is caused due to temperature. In various RO-PUF setups and operating conditions, we observe that around 4% of the PUF bits are prone to instability due to aging.
Keywords :
CMOS integrated circuits; ageing; elemental semiconductors; hot carriers; integrated circuit reliability; oscillators; silicon; BTI; CMOS manufacturing process; HCI; IC aging; PUF aging instability; PUF bits; PUF circuit-level choice; PUF responses; RO-PUF setups; bias temperature instability; chip-unique random bits; device aging; hot carrier injection; integrated circuits; random variation; reliability issue; ring oscillator PUF stability; ring oscillator physical unclonable functions; silicon PUF; silicon physical unclonable functions; size 90 nm; Aging; Bit error rate; Circuit stability; Integrated circuits; Ring oscillators; Stability analysis; Thermal stability;
Conference_Titel :
Quality Electronic Design (ISQED), 2014 15th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-3945-9
DOI :
10.1109/ISQED.2014.6783360