• DocumentCode
    123138
  • Title

    Circuit-level approach to improve the temperature reliability of Bi-stable PUFs

  • Author

    Ganta, D. ; Nazhandali, Leyla

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Tech, Blacksburg, VA, USA
  • fYear
    2014
  • fDate
    3-5 March 2014
  • Firstpage
    467
  • Lastpage
    472
  • Abstract
    Silicon Physical Unclonable Functions (PUF) have shown great promise for implementing chip IDs in a secure and inexpensive way. Bi-stable PUFs are particularly attractive as they inherently generate binary data. One of the major problems with bi-stable PUFs is their reliability to temperature variations. In this work, we improve the reliability of bi-stable PUFs by exploiting the differences between pMOS and nMOS in the threshold voltage (Vth) variation and in the dependence of Vth on temperature. Based on the 90nm simulations, the proposed circuit-level techniques show about a 70% reduction in the number of unreliable bits. We show that significant area savings can be achieved with improved reliability as the cost of error correction codes (ECC) implementation can be greatly minimized. We further show the applicability of the proposed technique in 130nm and 65nm technologies.
  • Keywords
    MOS integrated circuits; elemental semiconductors; error correction codes; integrated circuit reliability; silicon; ECC implementation; Si; binary data; bistable PUF; circuit-level techniques; error correction codes implementation; nMOS; pMOS; physical unclonable functions; size 130 nm; size 65 nm; size 90 nm; temperature reliability improvement; temperature variations; threshold voltage; Integrated circuit reliability; Inverters; MOSFET; Random access memory; Temperature measurement; PUF; SRAM; bistable; chip identifiers; process variation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2014 15th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-3945-9
  • Type

    conf

  • DOI
    10.1109/ISQED.2014.6783361
  • Filename
    6783361