DocumentCode
123138
Title
Circuit-level approach to improve the temperature reliability of Bi-stable PUFs
Author
Ganta, D. ; Nazhandali, Leyla
Author_Institution
Bradley Dept. of Electr. & Comput. Eng., Virginia Tech, Blacksburg, VA, USA
fYear
2014
fDate
3-5 March 2014
Firstpage
467
Lastpage
472
Abstract
Silicon Physical Unclonable Functions (PUF) have shown great promise for implementing chip IDs in a secure and inexpensive way. Bi-stable PUFs are particularly attractive as they inherently generate binary data. One of the major problems with bi-stable PUFs is their reliability to temperature variations. In this work, we improve the reliability of bi-stable PUFs by exploiting the differences between pMOS and nMOS in the threshold voltage (Vth) variation and in the dependence of Vth on temperature. Based on the 90nm simulations, the proposed circuit-level techniques show about a 70% reduction in the number of unreliable bits. We show that significant area savings can be achieved with improved reliability as the cost of error correction codes (ECC) implementation can be greatly minimized. We further show the applicability of the proposed technique in 130nm and 65nm technologies.
Keywords
MOS integrated circuits; elemental semiconductors; error correction codes; integrated circuit reliability; silicon; ECC implementation; Si; binary data; bistable PUF; circuit-level techniques; error correction codes implementation; nMOS; pMOS; physical unclonable functions; size 130 nm; size 65 nm; size 90 nm; temperature reliability improvement; temperature variations; threshold voltage; Integrated circuit reliability; Inverters; MOSFET; Random access memory; Temperature measurement; PUF; SRAM; bistable; chip identifiers; process variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2014 15th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-3945-9
Type
conf
DOI
10.1109/ISQED.2014.6783361
Filename
6783361
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