DocumentCode
1231550
Title
ICPA for highly integrated concurrent dual-band wireless receivers
Author
Zhang, C.C. ; Liu, J.J. ; Zhang, Y.F.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
39
Issue
12
fYear
2003
fDate
6/12/2003 12:00:00 AM
Firstpage
887
Lastpage
889
Abstract
A single-feed dual-band integrated circuit package antenna (ICPA) is reported. The ICPA, intended for use in either single-chip or single-package highly integrated concurrent dual-band wireless receivers, is implemented in the format of a cavity-down ceramic ball grid array package of 15×15×1.9 mm3. Results show that the ICPA achieved a frequency ratio of 2.2, return loss bandwidth of 1.67% and gain of -8 dBi at 2.4 GHz, and return loss bandwidth of 0.69% and gain of -2 dBi at 5.25 GHz.
Keywords
UHF antennas; ball grid arrays; ceramic packaging; microwave antennas; multibeam antennas; receiving antennas; 2.4 GHz; 5.25 GHz; ICPA; cavity-down ceramic ball grid array package; concurrent dual-band wireless receivers; frequency ratio; gain; integrated circuit package antenna; return loss bandwidth; single-feed dual-band antenna; wireless receivers;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20030582
Filename
1209473
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