DocumentCode
123193
Title
Maximizing throughput of power/thermal-constrained processors by balancing power consumption of cores
Author
Sinkar, Abhishek A. ; Hao Wang ; Nam Sung Kim
Author_Institution
Univ. of Wisconsin, Madison, WI, USA
fYear
2014
fDate
3-5 March 2014
Firstpage
633
Lastpage
638
Abstract
Technology scaling allows manufacturers to integrate more cores into a single chip (i.e., many-core processor), which delivers higher throughput by exploiting thread- and application-level parallelism. However, the chip´s power and thermal constraints, which do not scale well with technology scaling, began to limit the maximum throughput that can be delivered by many-core processors. Meanwhile, the integration of more cores with technology scaling increases within-die (WID) core-to-core (C2C) frequency and power variations, reducing performance/power efficiency of many-core processors. In this paper, we propose an optimization technique that can maximize the throughput of power- and thermal-constrained processors considering the WID C2C variations. The optimization technique exploits our following three observations. First, the WID C2C variations result in different power and frequency trade-offs between fast and slow cores in a processor. Second, the throughput is proportional to the average frequency of cores in a processor when the processor allows each core at its own frequency (i.e., per-core clocking). Third, fast cores, which consume more power due to higher frequency and leakage, experience more thermal throttling than slow cores. Our experiments using a 32nm technology demonstrate that the proposed optimization technique, which balances power consumption between the cores, is very effective for processors exhibiting large C2C frequency and power variances. The results show that the maximum throughput of 16-core processors with high C2C power variance can be improved by nearly up to 10%.
Keywords
multiprocessing systems; optimisation; power consumption; 16-core processors; C2C frequency; WID C2C variations; optimization; power consumption balancing; power/thermal-constrained processors; size 32 nm; Clocks; Integrated circuit modeling; Optimization; Power demand; Program processors; Runtime; Throughput; Muti-core; power; thermal; within-die process variations;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2014 15th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-3945-9
Type
conf
DOI
10.1109/ISQED.2014.6783386
Filename
6783386
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