Title :
Dry-contact technique for high-resolution ultrasonic imaging
Author :
Tohmyoh, Hironori ; Saka, Masumi
Author_Institution :
Dept. of Mech. Eng., Tohoku Univ., Sendai, Japan
fDate :
6/1/2003 12:00:00 AM
Abstract :
To accomplish a high-resolution ultrasonic imaging without wetting a sample, the efficiency of the dry-contact ultrasonic transmission is discussed. In this study, a dry-contact interface is formed on a sample by inserting a thin film between water and a sample, and the pressure is working on the interface by evacuating the air between the film and the sample. A model of dry-contact ultrasonic transmission is presented to assess the signal loss accompanied with the transmission. From the determination of the signal loss caused by the transmission using various films, it was found that the higher frequency ultrasound is transmitted effectively into the sample by selecting an optimum film, which can keep the displacement continuity between the film and the sample during ultrasonic transmission. Finally, ultrasonic imaging with the sufficient signal-to-noise ratio (SNR) and high lateral resolution was performed on the delamination in a package and the jointing interface of the ball-grid-array package without wetting the packages.
Keywords :
ball grid arrays; delamination; image resolution; inspection; integrated circuit packaging; polymer films; ultrasonic imaging; ultrasonic transmission; BGA package; IC package inspection; SNR; ball-grid-array package; dry-contact US transmission; dry-contact interface; dry-contact technique; high lateral resolution; high-resolution US imaging; jointing interface; optimum film; package delamination; signal loss; signal-to-noise ratio; ultrasonic imaging; ultrasonic transmission; Circuit testing; Frequency; Image resolution; Integrated circuit packaging; Piezoelectric transducers; Propagation losses; Signal resolution; Transistors; Ultrasonic imaging; Ultrasonic transducers;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2003.1209553