• DocumentCode
    1232922
  • Title

    Investigation of gross die per wafer formulas

  • Author

    De Vries, Dirk K.

  • Author_Institution
    Philips Semicond., Crolles, France
  • Volume
    18
  • Issue
    1
  • fYear
    2005
  • Firstpage
    136
  • Lastpage
    139
  • Abstract
    Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.
  • Keywords
    integrated circuit manufacture; wafer-scale integration; die area; die aspect ratio; die parameter; gross die per wafer count model; gross die per wafer formula investigation; integrated circuit manufacture; Clamps; Fabrication; Foundries; Sawing; Semiconductor device manufacture; Semiconductor device modeling; Standardization; Taylor series; Testing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2004.836656
  • Filename
    1393053