Title :
Investigation of gross die per wafer formulas
Author :
De Vries, Dirk K.
Author_Institution :
Philips Semicond., Crolles, France
Abstract :
Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.
Keywords :
integrated circuit manufacture; wafer-scale integration; die area; die aspect ratio; die parameter; gross die per wafer count model; gross die per wafer formula investigation; integrated circuit manufacture; Clamps; Fabrication; Foundries; Sawing; Semiconductor device manufacture; Semiconductor device modeling; Standardization; Taylor series; Testing;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2004.836656
