DocumentCode
1232922
Title
Investigation of gross die per wafer formulas
Author
De Vries, Dirk K.
Author_Institution
Philips Semicond., Crolles, France
Volume
18
Issue
1
fYear
2005
Firstpage
136
Lastpage
139
Abstract
Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.
Keywords
integrated circuit manufacture; wafer-scale integration; die area; die aspect ratio; die parameter; gross die per wafer count model; gross die per wafer formula investigation; integrated circuit manufacture; Clamps; Fabrication; Foundries; Sawing; Semiconductor device manufacture; Semiconductor device modeling; Standardization; Taylor series; Testing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2004.836656
Filename
1393053
Link To Document