• DocumentCode
    1232995
  • Title

    An evaluation of deadlock-handling strategies in semiconductor cluster tools

  • Author

    Venkatesh, Srilakshmi ; Smith, Jeffrey S.

  • Author_Institution
    Hewlett-Packard Co., Sunnyvale, CA, USA
  • Volume
    18
  • Issue
    1
  • fYear
    2005
  • Firstpage
    197
  • Lastpage
    201
  • Abstract
    We study the deadlock handling performance of a single-blade cluster tool and present a comparison of average flowtimes under deadlock detection and resolution versus prevention. Two detection and resolution policies are tested: either resolve permanent deadlocks or resolve both permanent and transient deadlocks. A permanent deadlock requires external intervention to resolve the deadlock, whereas a transient deadlock has a positive probability that the deadlock will resolve itself over time. Prevention averts deadlock by providing sufficient in-process buffer spaces. Our experiments indicate interplay of process and robot transfer times dictate the choice of deadlock strategy. Under low robot transfer times relative to process times, providing sufficient in-process buffer to prevent deadlock or resolving both permanent and transient deadlocks can be equally effective. We conclude with some practical guidelines for operating and designing cluster tools under deadlock conditions.
  • Keywords
    cluster tools; electronics industry; flexible manufacturing systems; machine tools; production management; resource allocation; deadlock detection; deadlock handling strategy; deadlock resolution; external intervention; in-process buffer spaces; permanent deadlock; process times; resolution policy; robot transfer times; semiconductor cluster tools; single blade cluster tool; transient deadlock; Control systems; Guidelines; Manufacturing systems; Orbital robotics; Resource management; Robot kinematics; Robotics and automation; Routing; System recovery; Testing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2004.836658
  • Filename
    1393060