DocumentCode
1233026
Title
Factory throughput improvements through intelligent integrated delivery in semiconductor fabrication facilities
Author
Li, Bo ; Wu, Johnny ; Carriker, Wayne ; Giddings, Ross
Author_Institution
Autom. Dept. of Portland Technol. Dev., Intel Corp., Hillsboro, OR, USA
Volume
18
Issue
1
fYear
2005
Firstpage
222
Lastpage
231
Abstract
"Integrated Delivery" is a system that integrates the automated material handling systems (AMHS) with process tools to automate the flow of material through a semiconductor fabrication facility (fab). It was developed to streamline operations in fully mechanized 300-mm wafer fabs by automating the delivery of lots to/from the tools, and automating all aspects of lot processing, with no manual intervention. Within this context, lot delivery performance is a critical factor impacting factory throughput. Poor material delivery performance translates into tools sitting idle waiting for lots to be delivered, which increases tool cycle time and decreases output. This work describes intelligent integrated delivery (IID) capabilities, including just-in-time proactive material movement and delivery prioritization, to reduce delivery time impacts. These capabilities significantly reduce the lot delivery queue time, and as a result, measurably improve factory throughput. The results have been demonstrated via theoretical modeling, as well through actual deployment in Intel\´s 300 mm fabs.
Keywords
electronics industry; integrated circuit manufacture; machine tools; materials handling equipment; production facilities; semiconductor device manufacture; 300 nm; automated material handling systems; intelligent integrated delivery; lot delivery queue time; semiconductor fabrication facility; tool cycle time; Fabrication; Joining processes; Manuals; Manufacturing automation; Materials handling; Performance analysis; Production facilities; Semiconductor device modeling; Throughput; Time measurement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2004.840530
Filename
1393063
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