Title :
A synthesis-for-transparency approach for hierarchical and system-on-a-chip test
Author :
Chakrabarty, Krishnendu
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
fDate :
4/1/2003 12:00:00 AM
Abstract :
Test data propagation through modules and test vector translation are two major challenges encountered in hierarchical testing. We propose a new synthesis-for-test approach in which multiplexers are embedded in the behavioral models of the various modules constituting a hierarchical system. This approach can also be applied to system-on-a-chip designs in which synthesizable models are available for the embedded cores. The embedded multiplexers provide complete single-cycle transparency, thereby offering a straightforward yet effective solution to the problems of test data propagation and test vector translation. In order to determine module I/O bitwidths for single-cycle transparency, a global analysis is carried out using a graph-theoretic framework and an optimization method based on integer linear programming. Case studies using high-level synthesis benchmarks and an industrial-strength benchmark show that synthesis for transparency introduces very little area and performance overhead.
Keywords :
design for testability; graph theory; high level synthesis; integer programming; integrated circuit design; integrated circuit modelling; integrated circuit testing; linear programming; system-on-chip; I/O bitwidth; behavioral model; embedded multiplexer; global analysis; graph theory; hierarchical testing; high-level synthesis; integer linear programming; optimization; single-cycle transparency; synthesis-for-test; synthesis-for-transparency; system-on-a-chip design; system-on-a-chip test; test data propagation; test vector translation; Benchmark testing; Circuit testing; Delay; Design for testability; Multiplexing; Operating systems; Power capacitors; System testing; System-on-a-chip; Very large scale integration;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2003.810784