• DocumentCode
    1233149
  • Title

    The new joint R&D

  • Author

    Ouchi, William G.

  • Author_Institution
    Anderson Graduate Sch. of Manage., California Univ., Los Angeles, CA, USA
  • Volume
    77
  • Issue
    9
  • fYear
    1989
  • fDate
    9/1/1989 12:00:00 AM
  • Firstpage
    1318
  • Lastpage
    1326
  • Abstract
    During the 1980s, a new form of collaborative research and development emerged in Europe, the US, and Japan. In this new form of joint R&D, companies that compete against one another join together for the purpose of creating new process technology in specified domains. This collaboration among competitors is justified for the development of technologies that many companies will ultimately use in a common manner. Such leaky technology typically cannot be effectively protected by patent or other means, and thus will not be developed except through collaborative means, in which those who benefit jointly incur the R&D expense. In Europe and Japan, governments typically provide 50-70% of the cost of such a joint project, while in the United States, government support for joint R&D is just now beginning to become available. The R&D collaboratives are described as being of two types: the secretariat, which is a coordinative body, and the operating entity, which operates its own R&D laboratory facilities. The conditions under which each organizational form appears, as well as the kinds of effort each form typically undertakes, are described
  • Keywords
    research and development management; semiconductor technology; Europe; Japan; US; collaborative research; development; government support; governments; joint R&D; laboratory facilities; operating entity; process technology; secretariat; Collaboration; Costs; Europe; Laboratories; Protection; Research and development; Silicon on insulator technology; Subcontracting; US Government; Wiring;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.35238
  • Filename
    35238