• DocumentCode
    1233410
  • Title

    Scalable high-power, high-speed CW VCSEL arrays

  • Author

    Safaisini, R. ; Joseph, J.R. ; Dang, G. ; Lear, K.L.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Colorado State Univ., Fort Collins, CO
  • Volume
    45
  • Issue
    8
  • fYear
    2009
  • Firstpage
    414
  • Lastpage
    415
  • Abstract
    A demonstration of a high-power, high-speed 980 nm vertical-cavity surface-emitting laser array with continuous-wave power of greater than 120 mW and frequency response over 7.5 GHz at room temperature is reported. Experimental results show that copper plating the array elements and flip-chip bonding provides effective thermal management as well as offering uniform current distribution at microwave frequencies. This is verified by the radial dependence of modulation bandwidth. These arrays may be useful for short-range light detection and ranging or free-space optical communications systems.
  • Keywords
    flip-chip devices; laser arrays; optical communication; space communication links; surface emitting lasers; flip-chip bonding; free-space optical communications systems; short-range light detection; thermal management; vertical-cavity surface-emitting laser array;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2009.3353
  • Filename
    4813166