DocumentCode :
1233410
Title :
Scalable high-power, high-speed CW VCSEL arrays
Author :
Safaisini, R. ; Joseph, J.R. ; Dang, G. ; Lear, K.L.
Author_Institution :
Electr. & Comput. Eng. Dept., Colorado State Univ., Fort Collins, CO
Volume :
45
Issue :
8
fYear :
2009
Firstpage :
414
Lastpage :
415
Abstract :
A demonstration of a high-power, high-speed 980 nm vertical-cavity surface-emitting laser array with continuous-wave power of greater than 120 mW and frequency response over 7.5 GHz at room temperature is reported. Experimental results show that copper plating the array elements and flip-chip bonding provides effective thermal management as well as offering uniform current distribution at microwave frequencies. This is verified by the radial dependence of modulation bandwidth. These arrays may be useful for short-range light detection and ranging or free-space optical communications systems.
Keywords :
flip-chip devices; laser arrays; optical communication; space communication links; surface emitting lasers; flip-chip bonding; free-space optical communications systems; short-range light detection; thermal management; vertical-cavity surface-emitting laser array;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2009.3353
Filename :
4813166
Link To Document :
بازگشت