• DocumentCode
    1233449
  • Title

    Comparison of Different Designs of a 42-V/14-V DC/DC Converter Regarding Losses and Thermal Aspects

  • Author

    Lee, Seung-Yo ; Pfaelzer, Arthur G. ; van Wyk, J.D.

  • Author_Institution
    Samsung Electron. Co., Ltd, Suwon-City
  • Volume
    43
  • Issue
    2
  • fYear
    2007
  • Firstpage
    520
  • Lastpage
    530
  • Abstract
    In this paper, thermal analysis for a 42-V/14-V bidirectional dc/dc converter with integrated inductors is performed. An interleaved dc/dc converter system with four channels was chosen for the automotive-converter topology with 42-V/14-V dual-output voltages. Coupled inductors were designed and used for the four-channel dc/dc converter. A 3-D thermal model based on finite-element modeling using I-DEAS is presented and the thermal behavior of the dc/dc converter system is simulated and analyzed. The thermal model includes a printed circuit board, integrated inductors, a heat sink, and switching devices (MOSFETs). The analyzed thermal result can help to design a converter system under severe ambient-temperature conditions
  • Keywords
    DC-DC power convertors; automotive electronics; coupled circuits; finite element analysis; heat sinks; inductors; network topology; printed circuits; switching convertors; 14 V; 3D thermal model; 42 V; MOSFET; ambient temperature conditions; automotive-converter topology; bidirectional DC-DC converter; coupled inductors; finite element modeling; four-channel DC-DC converter; heat sink; integrated inductors; interleaved DC-DC converter system; printed circuit board; switching devices; thermal analysis; thermal behavior; Analytical models; Circuit simulation; Coupling circuits; DC-DC power converters; Finite element methods; Inductors; Performance analysis; Printed circuits; Topology; Voltage; Bidirectional dc/dc converter; finite-element modeling (FEM); integrated inductor; thermal analysis;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2006.889808
  • Filename
    4132875