Title :
Full-Wave Model of Frequency-Dispersive Media With Debye Dispersion Relation by Circuit-Oriented FEM
Author :
Maradei, Francescaromana ; Ke, Haixin ; Hubing, Todd H.
Author_Institution :
Dept. of Electr. Eng., Sapienza Univ., Rome
fDate :
5/1/2009 12:00:00 AM
Abstract :
Dispersive materials play an important role in a wide variety of applications (e.g., waveguides, antenna structures, integrated circuits, bioelectromagnetic applications). In this paper, a full-wave finite-element method (FEM-SPICE) technique for modeling dispersive materials is proposed. A finite-element formulation employing Whitney elements capable of analyzing electromagnetic geometries with dispersive media is described, and a Norton equivalent network is developed for each element. The overall network can be analyzed using a circuit simulator based on SPICE, and is suitable for both frequency- and time-domain analysis. This approach exploits the flexibility of finite-element mesh generation and computational efficiency of modern circuit simulators. Simple test configurations are analyzed to validate the proposed formulation.
Keywords :
SPICE; dispersive media; frequency-domain analysis; mesh generation; time-domain analysis; Norton equivalent network; SPICE; Whitney elements; antenna structures; bioelectromagnetic applications; circuit simulators; circuit-oriented FEM; computational efficiency; debye dispersion relation; electromagnetic geometries; finite-element mesh generation; frequency-dispersive media; frequency-domain analysis; full-wave finite-element method; full-wave model; integrated circuits; time-domain analysis; Application specific integrated circuits; Biological materials; Circuit simulation; Computational modeling; Dispersion; Electromagnetic analysis; Electromagnetic waveguides; Finite element methods; Frequency; Geometry; Biological applications; Debye model; SPICE circuit simulator; Whitney element; circuit analysis; dispersive media; finite-element method (FEM); integrated circuits (ICs);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2009.2014639