• DocumentCode
    1234999
  • Title

    A study on the current density distribution in the circular contact surface

  • Author

    Park, Swwoong ; Na, Suck-Joo

  • Author_Institution
    Dept. of Production Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
  • Volume
    12
  • Issue
    3
  • fYear
    1989
  • fDate
    9/1/1989 12:00:00 AM
  • Firstpage
    325
  • Lastpage
    329
  • Abstract
    The distribution of the current density in the circular contact surface between two conducting semi-infinite bodies is theoretically analyzed. The current flow characteristics in the contact surface are simulated by solving a set of simultaneous equations derived from an analogy to the electrostatic charge distribution problem. The current density distribution is measured for uniform size of microcontacts by using enamel-coated copper wires and electrolyte, and the experimental results are compared with the calculated current density for various densities of the microcontact. It is revealed that the experimental and theoretical results are in good agreement. By using the proposed theoretical model the current density can be calculated also for circular contacts with arbitrary size and distribution of microcontacts, if the size and distribution of microcontacts are given from experimental or theoretical studies. Therefore, the proposed model can be used effectively to determine the current density distribution in the circular-shaped contact surface with multiple microcontacts
  • Keywords
    electrical contacts; circular contact surface; current density distribution; distribution of microcontacts; electrolyte; experimental results; insulated wire; model; multiple microcontacts; simultaneous equations; two conducting semi-infinite bodies; Contacts; Copper; Current density; Electric resistance; Electrostatics; Equations; Production engineering; Rough surfaces; Surface roughness; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.35477
  • Filename
    35477