The high-frequency characteristics of tape automated bonding (TAB) interconnects

Author

Wentworth, S.M. ; Neikirk, D.P. ; Brahce, Carl R.

Author_Institution

Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

Volume

12

Issue

3

fYear

1989

fDate

9/1/1989 12:00:00 AM

Firstpage

340

Lastpage

347

Abstract

Tape automated bonding (TAB) tape is modeled as a transmission line, since, above 5 GHz, the tape length is significant compared to the signal wavelength. A test chip was fabricated to allow determination of the microwave characteristics of 3M´s 120-lead, two-layer gold-plated electrodeposited copper tape, which has a polyimide support layer and an inner lead pitch of 8 mils. A characteristic impedance of 100±10 Ω was found for the tape based upon measurement up to 18 GHz. This compares well with the theoretical model, which predicts an impedance between 98 and 118 Ω. Theoretical models and practical considerations were used to design a TAB tape with a lower impedance and good signal isolation. This design is presented

Keywords

lead bonding; microwave measurement; 100 ohm; 120-lead; 5 to 18 GHz; TAB tape; characteristic impedance; high-frequency characteristics; inner lead pitch; interconnects; microwave characteristics; polyimide support layer; signal isolation; tape automated bonding; test chip; transmission line; Bonding; Copper; Impedance measurement; Polyimides; Predictive models; Semiconductor device measurement; Signal design; Testing; Transmission line theory; Wavelength measurement;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.35480

Filename

35480