Title :
Bit error rate determination of RSFQ logic cells by means of noise analysis of basic network components
Author :
Ortlepp, Thomas ; Toepfer, Hannes ; Uhlmann, F. Hermann
Author_Institution :
Dept. of Fundamentals & Theor. of Electr. Eng., Univ. of Technol. Ilmenau, Germany
fDate :
6/1/2003 12:00:00 AM
Abstract :
The influence of thermal noise gives a major restriction in the development of Rapid Single Flux Quantum (RSFQ) logic circuits with high-Tc superconductors. In the past, we have demonstrated a general way for determining the digital bit error rate and for predicting operation ranges with good noise immunity. The method is based on a single Fokker-Planck equation which includes the full system dynamics. However, the complexity of this equation increases dramatically with the number of Josephson junctions. Our new approach describes a method to divide an RSFQ logic cell into several basic primitives. They can be characterized quickly in terms of switching probability for a lot of different parameters. From these analyses, look-up tables are built-up. We describe how to combine these data in order to achieve the bit-error rate for the whole cell. While saving more than 90% of computation time, the comparison with our previous results for full system analyses shows less than 4% difference. This approach provides for a powerful tool to include the influence of thermal noise into the optimization process of RSFQ logic circuits as well.
Keywords :
high-temperature superconductors; integrated circuit noise; superconducting device noise; superconducting logic circuits; thermal noise; Josephson junctions; RSFQ logic cells; bit error rate determination; bit-error rate; computation time; high-Tc superconductors; look-up tables; noise analysis; rapid single flux quantum logic; switching probability; thermal noise; Bit error rate; Circuit noise; Circuit simulation; Equations; Error analysis; Josephson junctions; Logic circuits; Superconducting device noise; Superconductivity; Switching circuits;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.813920