DocumentCode :
1237449
Title :
A Study of Self-Aligned Nitride Erasable OTP Cell by 45-nm CMOS Fully Compatible Process
Author :
Huang, Chia-En ; Chen, Ying-Je ; Lai, Han-Chao ; King, Ya-Chin ; Lin, Chrong Jung
Author_Institution :
Inst. of Electron. Eng., Nat. Tsing-Hua Univ., Hsinchu
Volume :
56
Issue :
6
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
1228
Lastpage :
1234
Abstract :
This brief proposes a new 45-nm erasable one-time programming cell with a self-aligned nitride (SAN) storage node for logic nonvolatile memory (NVM) applications. The CMOS fully logic-compatible cell was successfully demonstrated using 45-nm CMOS technology with a very small cell size of 0.1188 mum2. This cell-adapting source-side-injection programming scheme has a wide on/off window and superior program efficiency. The SAN cell with five terminals for various operational conditions uses an asymmetrical read voltage to verify the position of the stored charge. This cell also exhibits excellent data retention capability even when the thickness of the logic gate oxide is less than 20 A, and the gate length is shorter than 40 nm. This new cell provides a promising solution for logic NVM beyond a 90-nm node.
Keywords :
CMOS integrated circuits; integrated logic circuits; random-access storage; silicon compounds; CMOS fully compatible process; SiN; data retention capability; erasable one-time programming cell; logic gate oxide; nonvolatile memory; self-aligned nitride; size 45 nm; CMOS logic circuits; CMOS process; CMOS technology; Logic design; Logic devices; Logic programming; Manufacturing processes; Nonvolatile memory; Storage area networks; Voltage; Logic compatible; nonvolatile memory (NVM); p-channel; self-aligned nitride (SAN);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2018169
Filename :
4814512
Link To Document :
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