DocumentCode :
1237592
Title :
High-Tc SQUID sensors with integrated Earth field compensation
Author :
Drung, Dietmar ; Schurig, Thomas
Author_Institution :
Phys. Tech. Bundesanstalt, Berlin, Germany
Volume :
13
Issue :
2
fYear :
2003
fDate :
6/1/2003 12:00:00 AM
Firstpage :
751
Lastpage :
754
Abstract :
An encapsulation with integrated field compensation coils for superconducting quantum interference device (SQUID) magnetometers is presented. The capsule is fabricated from printed-circuit board material. In spite of the small capsule size of 18 mm×16 mm×4.8 mm, the compensation field at nominal capsule dimensions is homogeneous to about ±2% over the area of the SQUID magnetometer pickup coil of 9 mm×9 mm. The field homogeneity degrades by about a factor of two for worst-case tolerances in the thickness of the board material or in the positions of the field coils. A low-noise current source was integrated into our microcontroller-based SQUID readout electronics in order to supply the field coils. Compensation fields of up to ±71 μT can be produced with only 19 fT/√Hz excess noise above the 1/f corner at about 2 Hz. The current source has a 10%-90% settling time of 2.2 ms allowing one to compensate the background field dynamically in environments with very large low-frequency field fluctuations or even in slowly moved sensor systems.
Keywords :
1/f noise; SQUID magnetometers; compensation; encapsulation; high-temperature superconductors; readout electronics; superconducting device noise; 1/f noise; SQUID magnetometer; encapsulation; field homogeneity; high-Tc SQUID sensor; integrated Earth field compensation coil; low-noise current source; microcontroller readout electronics; pickup coil; printed circuit board; Background noise; Degradation; Encapsulation; Interference; Magnetic materials; Readout electronics; SQUID magnetometers; Superconducting coils; Superconducting devices; Superconducting materials;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2003.814029
Filename :
1211712
Link To Document :
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