• DocumentCode
    123849
  • Title

    IC design course based on the Synopsys DesignWare ARC 600 processor core and 32/28nm Educational Design Kit

  • Author

    Goldman, R. ; Bartleson, Karen ; Wood, Tim ; Watson, Alan ; Melikyan, Vazgen ; Babayan, E. ; Hakhverdyan, Tigran

  • Author_Institution
    Synopsys Inc., Mountain View, CA, USA
  • fYear
    2014
  • fDate
    3-3 March 2014
  • Firstpage
    66
  • Lastpage
    69
  • Abstract
    Due to the rapid development times, device complexity, etc. of the semiconductor industry it is challenging for universities to teach modern Integrated Circuit (IC) design. In particular, universities lack access to the necessary semiconductor technology data required to implement educational projects, as this information is normally proprietary. Additionally, access to state-of-the-art designs is also usually not available in the university environment. This paper presents an IC design course developed with the DesignWare® ARC® 600 Academic [1] processor core and the Synopsys 32/28nm Educational Design Kit (EDK) [2] available to universities through the Synopsys University Program. The course provides students with theoretical knowledge and practical experience in designing real ICs.
  • Keywords
    educational courses; educational institutions; integrated circuit design; microprocessor chips; semiconductor industry; semiconductor technology; IC design course; Synopsys DesignWare ARC 600 processor core; Synopsys University Program; device complexity; educational design kit; educational projects; integrated circuit design; semiconductor industry; semiconductor technology data; universities; university environment; Clocks; Computer architecture; Educational institutions; Libraries; Microprocessors; Standards; ARC 600 core; DesignWare ARC Processors; EDK; synthesis; verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interdisciplinary Engineering Design Education Conference (IEDEC), 2014 4th
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-4381-4
  • Type

    conf

  • DOI
    10.1109/IEDEC.2014.6784682
  • Filename
    6784682