Title :
EUROSERVER: Energy Efficient Node for European Micro-Servers
Author :
Durand, Yves ; Carpenter, Paul M. ; Adami, Stefano ; Bilas, Angelos ; Dutoit, Denis ; Farcy, A. ; Gaydadjiev, Georgi ; Goodacre, John ; Katevenis, Manolis ; Marazakis, Manolis ; Matus, Emil ; Mavroidis, Iakovos ; Thomson, J.
Author_Institution :
LETI, Univ. Grenoble Alpes, Grenoble, France
Abstract :
EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon "chiplets" on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.
Keywords :
cloud computing; computer centres; file servers; groupware; microprocessor chips; silicon-on-insulator; virtualisation; 3D heterogeneous silicon-on-silicon integration; ARM cores; EUROSERVER; FD SOI process technology; NRE cost; active silicon interposer; cloud computing; collaborative project; data centre energy-efficiency; data centres; embedded server; energy efficient node for European microservers; enterprise server; fully-depleted silicon-on-insulator; high-end embedded system; resource management; resource sharing; silicon device; system architecture approach; telecom infrastructure; workload isolation; Computer architecture; Energy efficiency; Hardware; Program processors; Servers; Silicon; ARM; FD-SOI; Three-dimensional (3D) integrated circuits; system architecture; virtualization;
Conference_Titel :
Digital System Design (DSD), 2014 17th Euromicro Conference on
Conference_Location :
Verona
DOI :
10.1109/DSD.2014.15