• DocumentCode
    123911
  • Title

    EUROSERVER: Energy Efficient Node for European Micro-Servers

  • Author

    Durand, Yves ; Carpenter, Paul M. ; Adami, Stefano ; Bilas, Angelos ; Dutoit, Denis ; Farcy, A. ; Gaydadjiev, Georgi ; Goodacre, John ; Katevenis, Manolis ; Marazakis, Manolis ; Matus, Emil ; Mavroidis, Iakovos ; Thomson, J.

  • Author_Institution
    LETI, Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    206
  • Lastpage
    213
  • Abstract
    EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon "chiplets" on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.
  • Keywords
    cloud computing; computer centres; file servers; groupware; microprocessor chips; silicon-on-insulator; virtualisation; 3D heterogeneous silicon-on-silicon integration; ARM cores; EUROSERVER; FD SOI process technology; NRE cost; active silicon interposer; cloud computing; collaborative project; data centre energy-efficiency; data centres; embedded server; energy efficient node for European microservers; enterprise server; fully-depleted silicon-on-insulator; high-end embedded system; resource management; resource sharing; silicon device; system architecture approach; telecom infrastructure; workload isolation; Computer architecture; Energy efficiency; Hardware; Program processors; Servers; Silicon; ARM; FD-SOI; Three-dimensional (3D) integrated circuits; system architecture; virtualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design (DSD), 2014 17th Euromicro Conference on
  • Conference_Location
    Verona
  • Type

    conf

  • DOI
    10.1109/DSD.2014.15
  • Filename
    6927246