DocumentCode :
1240045
Title :
Modular SOC testing with reduced wrapper count
Author :
Xu, Qiang ; Nicolici, Nicola
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
Volume :
24
Issue :
12
fYear :
2005
Firstpage :
1894
Lastpage :
1908
Abstract :
Motivated by the increasing design for test (DFT) area overhead and potential performance degradation caused by wrapping all the embedded cores for modular system-on-a-chip (SOC) testing, this paper proposes a solution for reducing the number of wrapper boundary register (WBR) cells. By utilizing the functional interconnect topology and the WBRs of the surrounding cores to transfer test stimuli and responses, the WBRs of some cores can be removed without affecting the testability of the SOC. We denote the cores without WBRs as light-wrapped cores and present a new modular SOC test architecture for concurrently testing both the wrapped and the light-wrapped logic cores. Since the WBRs of cores that transfer test stimuli and test responses for light-wrapped cores become shared resources during test, conflicts arise during test scheduling that will negatively impact the test application time. As a consequence, to alleviate this problem, we present a novel test access mechanism (TAM) design algorithm for the proposed SOC test architecture. We conduct experiments on several SOC benchmark circuits and demonstrate that, with an acceptable increase in test application time, the number of WBRs can be significantly decreased. This will ultimately lessen the necessary DFT area for modular SOC testing and reduce the propagation delays between cores.
Keywords :
design for testability; integrated circuit design; integrated circuit testing; system-on-chip; DFT area; SOC benchmark circuit; SOC testing; TAM design algorithm; WBR cells; core wrapper; design for test; electronic test; embedded core; functional interconnect topology; light-wrapped core; light-wrapped logic cores; modular SOC test architecture; modular system-on-a-chip testing; performance degradation; propagation delay; test access mechanism design; test scheduling; wrapped logic cores; wrapper boundary register cell; wrapper count; Algorithm design and analysis; Circuit testing; Degradation; Design for testability; Integrated circuit interconnections; Logic testing; System testing; System-on-a-chip; Topology; Wrapping; Core wrapper; electronic test; system-on-a-chip (SOC);
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2005.852447
Filename :
1542243
Link To Document :
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