Title :
A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules
Author :
Zhu, Ning ; Van Wyk, Jacobus Daniel ; Liang, Zhenxian ; Odendaal, Willem G Hardus
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. & State Univ., Blacksburg, VA, USA
Abstract :
In integrated power modules, mechanical properties of interfaces between deposited copper traces and substrates are important for reliable operation. This paper investigates the values of thermomechanical stresses by IDEAS simulation and describes an experimental method to calculate intrinsic residual stresses using the Stoney equation based on the bending curvature of the sample.
Keywords :
internal stresses; power electronics; IDEAS; Stoney equation; bending curvature; integrated power modules; intrinsic residual stress; planar metallization; thermal stress; thermomechanical stresses; Electromagnetic interference; Failure analysis; Insulated gate bipolar transistors; Integrated circuit interconnections; Metallization; Multichip modules; Power electronics; Residual stresses; Thermal stresses; Thermomechanical processes; Intrinsic residual stress; planar metallization; thermomechanical stress;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2005.858313
