DocumentCode
1240717
Title
Deposition of CeO2 buffer layers for YBCO coated conductors on biaxially textured Ni substrates by MOCVD technique
Author
Kim, Ho-Jin ; Joo, Jinho ; Ji, Bong Ki ; Jun, Byung-Hyuk ; Jung, Choong-Hwan ; Park, Soon-Dong ; Park, Hai-Woong ; Hong, Gye-Won ; Kim, Chan-Joong
Author_Institution
Dept. of Adv. Mater. Eng., Sungkyunkwan Univ., Suwon, South Korea
Volume
13
Issue
2
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
2555
Lastpage
2558
Abstract
CeO2 buffer layers for YBa2Cu3O7(YBCO) coated conductors were deposited on biaxially textured Ni substrates by metalorganic chemical vapor deposition (MOCVD) method. The variables were the oxygen partial pressure (PO2), deposition temperature and time. The [200] texture of CeO2 was formed at T = 500 °C - 520 °C, t = 3 - 15 min and PO2 = 2.30 torr, while the [111] and [200] texture were competitively formed at other condition. The surface roughness of CeO2 films was as good as 5 - 15 nm up to 500 °C, while it rapidly increased as a result of grain growth of the CeO2 at T ≥ 520 °C. The surface roughness of the CeO2 films also increased as the deposition time increased. The growth rate of the CeO2 films at T = 520 °C and PO2 = 2.30 torr was 200 nm/min, which is much higher than those prepared by other physical deposition methods.
Keywords
MOCVD coatings; barium compounds; cerium compounds; high-temperature superconductors; nickel; superconducting tapes; superconducting thin films; surface texture; surface topography; yttrium compounds; 2.30 torr; 3 to 15 min; 5 to 15 nm; 500 to 520 degC; CeO2; CeO2 buffer layers; MOCVD; Ni; YBCO coated conductors; YBa2Cu3O7; biaxially textured Ni substrates; high temperature superconductor; surface roughness; texture; Buffer layers; Chemical vapor deposition; Conductors; MOCVD; Power engineering and energy; Rough surfaces; Substrates; Surface roughness; Temperature; Yttrium barium copper oxide;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2003.811846
Filename
1212137
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