Inductive analysis of magnetic granularity effects in YBCO IBAD and RABiTS coated conductors

Author

Palau, A. ; Puig, T. ; Obradors, X. ; Usoskin, A. ; Freyhardt, H.C. ; Fernàndez, L. ; Holzapfel, B.

Author_Institution

Inst. de Ciencia de Mater. de Barcelona, Bellaterra, Spain

Volume

13

Issue

2

fYear

2003

fDate

6/1/2003 12:00:00 AM

Firstpage

2599

Lastpage

2602

Abstract

We present a noninvasive inductive analysis of YBa₂Cu₃O₇ (YBCO) IBAD (ion beam assisted deposition) and RABiTS (rolling assisted biaxial textured substrates) coated conductors that enable us to analyze the electromagnetic granularity effects. We distinguish flux penetration through grain boundaries and grains and determine the inductive intergranular critical current density. The signature of reverse flux at low angle grain boundaries has been clearly identified by the appearance of a peak in the return branch of the irreversible magnetization. The present analysis evidence that IBAD and RABiTS coated conductors may exhibit comparable inter-grain critical current densities with the determining factor being the average in-plane grain misorientation.

Keywords

barium compounds; critical current density (superconductivity); crystal microstructure; grain boundaries; high-temperature superconductors; magnetic hysteresis; magnetisation; penetration depth (superconductivity); superconducting tapes; yttrium compounds; IBAD; RABiTS; YBCO coated conductors; YBa₂Cu₃O₇; electromagnetic granularity effects; flux penetration; grain boundaries; grain misorientation; inductive intergranular critical current density; ion beam assisted deposition; irreversible magnetization; magnetic granularity effects; noninvasive inductive analysis; reverse flux; rolling assisted biaxial textured substrates; Conductors; Critical current density; Electromagnetic analysis; Electromagnetic induction; Grain boundaries; Ion beams; Magnetic analysis; Magnetic flux; Magnetization; Yttrium barium copper oxide;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2003.811858

Filename

1212149