Title :
Textured growth of multi-layered buffer layers on Ni tape by sol-gel process
Author :
Akin, Y. ; Aslanoglu, Z. ; Celik, E. ; Arda, L. ; Sigmund, W. ; Hascicek, Y.S.
Author_Institution :
NHMFL, Tallahassee, FL, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
Textured Cerium Oxide (CeO2)/Yttrium-Stabilized Zirconia (YSZ)/CeO2 buffer layers structure were grown by sol-gel dip coating process on bi-axially textured Ni tapes for processing of YBCO coated conductors. CeO2/YSZ/CeO2 buffer layer structure has been demonstrated by vacuum techniques, but first time textured CeO2/YSZ/CeO2 structure were grown by sol-gel on biaxially textured Ni tape. The buffer layer structure promoted c-axis oriented sol-gel YBCO films and prevented oxidation of nickel during YBCO processing. After each layer was coated, the layer was annealed. CeO2 layers were annealed at 950 °C for 30 min. and YSZ layers were annealed at 1150 °C for 10 min. under 4% H2 - Ar gas flow. Texture analysis of Ni substrates and bottom CeO2 were done by Philips diffractometer. Sol-gel YBCO layers were coated on CeO2/YSZ/CeO2 structure and critical current density was about 0.5 × 105 A/cm2. Microstructure of the buffer layer was investigated by Environmental Scanning Electron Microscope (ESEM).
Keywords :
annealing; cerium compounds; critical current density (superconductivity); high-temperature superconductors; liquid phase deposited coatings; nickel; sol-gel processing; superconducting tapes; superconducting thin films; texture; yttrium compounds; zirconium compounds; 10 min; 1150 degC; 30 min; 950 C; CeO2-ZrO2Y2O3; CeO2/YSZ/CeO2 buffer layers structure; ESEM; Ni; Ni tape; YBCO coated conductors; YBa2Cu3O7; buffer layer structure; critical current density; high temperature superconductor; multi-layered buffer layers; sol-gel dip coating process; sol-gel process; textured growth; vacuum techniques; Annealing; Buffer layers; Cerium; Conductors; Dip coating; Nickel; Oxidation; Vacuum technology; Yttrium barium copper oxide; Yttrium compounds;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.811947