DocumentCode :
1241000
Title :
Electrohydrodynamic micropumps with asymmetric electrode geometries for microscale electronics cooling
Author :
Kazemi, P. Zangeneh ; Selvaganapathy, P. Ravi ; Ching, Chan Y.
Author_Institution :
Dept. of Mech. Eng., McMaster Univ., Hamilton, ON
Volume :
16
Issue :
2
fYear :
2009
fDate :
4/1/2009 12:00:00 AM
Firstpage :
483
Lastpage :
488
Abstract :
The development of effective microscale thermal management solutions is important to further advance microscale electronics because of increasing heat flux densities in these devices. There is an increasing trend towards liquid based cooling solutions because of their much higher heat removal capacities compared to air cooling methods. Electrohydrodynamic (EHD) micropumps are ideally suited for these applications due to their small form factor, low power consumption and ability to work with dielectric heat transfer fluids. In addition, EHD micropumps have no moving parts and are amenable to conventional microfabrication techniques. Current EHD micropump designs, however, generate very low flowrates and pressure head to be practically useful. Here, we demonstrate for the first time, that an asymmetry in the electrode geometry (both 2D and 3D) will result in significantly higher pressure generation with lower power consumption than conventional symmetric electrode designs.
Keywords :
cooling; electrodes; electrohydrodynamics; heat transfer; integrated circuit packaging; micromechanical devices; micropumps; power consumption; asymmetric electrode geometry; dielectric heat transfer fluids; electrohydrodynamic micropumps; heat flux density; liquid based cooling solutions; microscale electronics cooling; power consumption; pressure generation; Dielectrics; Electrodes; Electrohydrodynamics; Electronics cooling; Energy consumption; Geometry; Heat transfer; Micropumps; Thermal management; Thermal management of electronics; Electrohydrodynamics, micropumps, ion drag, electrode geometry;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2009.4815182
Filename :
4815182
Link To Document :
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