Title :
Optimization of surface morphology and electrical parameters of Tl-Ba-Ca-Cu-O thin films for high frequency devices
Author :
Schneidewind, Henrik ; Stelzner, Thomas
Author_Institution :
Inst. for Phys. High Technol., Jena, Germany
fDate :
6/1/2003 12:00:00 AM
Abstract :
We prepared double-sided Tl2Ba2CaCu2O8 (Tl-2212) thin films on large area sapphire substrates (up to 3 inch) for high frequency filters, which are intended to be used in future communication systems. For high frequency operation one demands film thicknesses three or four times the penetration depth λ, but the thin film preparation process has several limits for the film thickness. Beside the crack formation on sapphire substrates due to different thermal expansion coefficients the surface morphology with parameters as roughness or the formation of precipitates depend on the film thickness. We show results of an optimization process to achieve the best suitability of the films for high frequency devices. The investigations were done in terms of SEM and AFM surface inspections as well as the measurement of electrical film parameters as critical temperature Tc, critical current density Jc, or surface resistance Rs.
Keywords :
atomic force microscopy; barium compounds; calcium compounds; critical current density (superconductivity); high-temperature superconductors; penetration depth (superconductivity); scanning electron microscopy; superconducting filters; superconducting thin films; superconducting transition temperature; surface morphology; surface resistance; thallium compounds; 3 inch; AFM; SEM; Tl-Ba-Ca-Cu-O thin film; Tl2Ba2CaCu2O8; communication system; crack formation; critical current density; critical temperature; electrical parameters; high temperature superconductor; high-frequency filter; penetration depth; process optimization; sapphire substrate; surface morphology; surface precipitation; surface resistance; surface roughness; thermal expansion coefficient; Filters; Frequency; Rough surfaces; Substrates; Surface morphology; Surface resistance; Surface roughness; Thermal expansion; Thin film devices; Transistors;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.811999