• DocumentCode
    1241805
  • Title

    Effects of Ag buffer and Pt intermediate layers on magnetic properties of epitaxial Co/Pt multilayers

  • Author

    Wei, D.H. ; Chou, S.C. ; Chin, T.S. ; Yu, C.C. ; Yao, Y.D. ; Liou, Y.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    41
  • Issue
    2
  • fYear
    2005
  • Firstpage
    912
  • Lastpage
    914
  • Abstract
    Co/Pt multilayers were prepared on silicon substrates with a Ag buffer of different thickness and Pt intermediate layers by using the molecular-beam epitaxial technique. The as-deposited films (at 160°C) were then post-annealed for 30 min in a vacuum at a temperature (Tan) ranging from 260°C to 500°C. The formation of CoPt L10-ordered structure were observed for all the samples grown at 160°C. The out-of-plane coercivity (Hc) and saturation magnetization (Ms) of all Co/Pt multilayer films decreased monotonically as elevating annealing temperature, owing to the heavy diffusion of Si into Co/Pt films at higher temperatures. When Tan reaches 500°C, the formation of PtSi phase destroys the magnetic properties.
  • Keywords
    annealing; buffer layers; cobalt alloys; coercive force; magnetic epitaxial layers; magnetic multilayers; magnetic recording; metallic epitaxial layers; molecular beam epitaxial growth; platinum alloys; silicon; silver; Ag; Ag buffer; Co-Pt; Pt intermediate layers; Si interdiffusion; buffer layer; epitaxial multilayers; magnetic properties; molecular-beam epitaxial technique; ordering temperature; out-of-plane coercivity; post-annealing; saturation magnetization; silicon substrates; Coercive force; Magnetic films; Magnetic multilayers; Magnetic properties; Molecular beam epitaxial growth; Saturation magnetization; Semiconductor films; Silicon; Substrates; Temperature distribution; Buffer layer; Co/Pt alloy; Si interdiffusion; multilayer deposition; ordering temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2004.842138
  • Filename
    1396255