Title :
Optoelectronic packaging using silicon surface-micromachined alignment mirrors
Author :
Solgaard, O. ; Daneman, M. ; Tien, N.C. ; Friedberger, A. ; Muller, R.S. ; Lau, K.Y.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-filter (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.
Keywords :
integrated circuit packaging; integrated optoelectronics; micromachining; micromechanical devices; mirrors; optical fabrication; position control; 45 percent; Si; Si suface-micromachined alignment mirrors; batch-assembled optoelectronic packaging technology; coupling efficiency; laser-to-filter coupling; mechanical stability; mechanical structure; open-loop position accuracy; single mode coupling; Laser modes; Laser stability; Mechanical variables measurement; Mirrors; Optical coupling; Position measurement; Semiconductor device packaging; Semiconductor lasers; Silicon; Surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE
