Optoelectronic packaging using silicon surface-micromachined alignment mirrors

Author

Solgaard, O. ; Daneman, M. ; Tien, N.C. ; Friedberger, A. ; Muller, R.S. ; Lau, K.Y.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

Volume

7

Issue

1

fYear

1995

Firstpage

41

Lastpage

43

Abstract

We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-filter (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.

Keywords

integrated circuit packaging; integrated optoelectronics; micromachining; micromechanical devices; mirrors; optical fabrication; position control; 45 percent; Si; Si suface-micromachined alignment mirrors; batch-assembled optoelectronic packaging technology; coupling efficiency; laser-to-filter coupling; mechanical stability; mechanical structure; open-loop position accuracy; single mode coupling; Laser modes; Laser stability; Mechanical variables measurement; Mirrors; Optical coupling; Position measurement; Semiconductor device packaging; Semiconductor lasers; Silicon; Surface emitting lasers;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.363382

Filename

363382