Bond-and-transfer scanning probe array for high-density data storage

This paper reports a study of a wafer-level bond-and-transfer technique for scanning probe arrays and its future application on probe-based data storage. The bonding performance between sodium ion-rich glass and silicon-nitride-deposited silicon substrate has been characterized. The effects of tool pressure, bonding time, surface properties, and cleanliness were thoroughly discussed. Furthermore, the silicon-nitride-based scanning probe array with pyramidal tip and 1.5-μm-thick cantilevers were successful bonded and transferred to Pyrex 7740 substrate by the optimized condition of wafer-scale electrostatic force bonding and transferring processes. The nano-patterning capabilities of scanning probe array for high-density data storage were also discussed.