Title :
Direct formation of A15 phase through RHQ treatment in RIT processed Nb/Al-Cu precursor wire
Author :
Iijima, Y. ; Kikuchi, A. ; Banno, N. ; Takeuchi, T. ; Inoue, K.
Author_Institution :
Supercond. Mater. Center, Nat. Inst. for Mater. Sci., Tsukuba, Japan
fDate :
6/1/2003 12:00:00 AM
Abstract :
In Nb3Al wire with 2.5at% added copper, the Nb3Al filaments form directly during a RHQ (rapid heating and quenching) treatment and show excellent superconducting properties. The Nb3Al filaments appear to form rapidly during the quenching, because many stacking faults are observed. We found that two different transformation conditions yielded excellent superconducting properties. At high temperature, the Cu-added Nb3Al wire showed Tc of 18.3 K, Birr (4.2 K) of 29.3 T, and Jc (4.2 K, 20 T) of 800 A/mm2, while at lower temperature these values were 18.2 K, 29.4 T, and 710 A/mm2. Although the resultant properties are similar, the latter processing conditions produced a significant quantity of σ-phase particles. The net Jc (4.2 K) of Nb3Al phase in this latter wire is very high, e.g., 1760, 1180, and 700 A/mm2 at 18, 20 and 22 T respectively.
Keywords :
alloying additions; aluminium alloys; copper alloys; critical current density (superconductivity); multifilamentary superconductors; niobium alloys; phase separation; quenching (thermal); rapid thermal processing; stacking faults; superconducting transition temperature; type II superconductors; σ-phase particles; 18 T; 18.2 K; 18.3 K; 20 T; 22 T; 29.3 T; 29.4 T; 4.2 K; A15 filaments; A15 phase; Nb/Al-Cu precursor wire; Nb3Al wire; Nb3Al-Cu; RHQ treatment; RIT processing; quenching; rapid heating; stacking faults; superconducting critical current density; superconducting transition temperature; transformation conditions; Copper; Heat treatment; Heating; High temperature superconductors; Intermetallic; Microstructure; Multifilamentary superconductors; Niobium; Stacking; Superconducting filaments and wires;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.812337