• DocumentCode
    1243265
  • Title

    New high power planar gate GaAs MESFETs with improved gate-drain breakdown voltage

  • Author

    Fujimoto, H. ; Tanabe, M. ; Maeda, M. ; Tamura, A.

  • Author_Institution
    Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
  • Volume
    31
  • Issue
    2
  • fYear
    1995
  • fDate
    1/19/1995 12:00:00 AM
  • Firstpage
    137
  • Lastpage
    139
  • Abstract
    The authors present a new approach to power GaAs MESFETs with planar gate structures, based on the MBE growth technique on an undoped surface GaAs layer on an ion-implanted channel layer. This undoped GaAs layer increases the gate-drain breakdown voltage and serves as both an ideal passivation layer and an ideal annealing cap of ion implanted channels. To realise a good surface condition before MBE growth, the UV-ozone surface treatment is introduced. This new simple structure offers high performance power GaAs MESFETs
  • Keywords
    III-V semiconductors; annealing; electric breakdown; gallium arsenide; ion implantation; molecular beam epitaxial growth; passivation; power MESFET; surface treatment; GaAs; MBE growth technique; UV-ozone surface treatment; annealing cap; gate-drain breakdown voltage; high power MESFETs; ion-implanted channel layer; passivation layer; planar gate structures; power FETs; undoped surface GaAs layer;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19950070
  • Filename
    364346