DocumentCode :
1243265
Title :
New high power planar gate GaAs MESFETs with improved gate-drain breakdown voltage
Author :
Fujimoto, H. ; Tanabe, M. ; Maeda, M. ; Tamura, A.
Author_Institution :
Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
Volume :
31
Issue :
2
fYear :
1995
fDate :
1/19/1995 12:00:00 AM
Firstpage :
137
Lastpage :
139
Abstract :
The authors present a new approach to power GaAs MESFETs with planar gate structures, based on the MBE growth technique on an undoped surface GaAs layer on an ion-implanted channel layer. This undoped GaAs layer increases the gate-drain breakdown voltage and serves as both an ideal passivation layer and an ideal annealing cap of ion implanted channels. To realise a good surface condition before MBE growth, the UV-ozone surface treatment is introduced. This new simple structure offers high performance power GaAs MESFETs
Keywords :
III-V semiconductors; annealing; electric breakdown; gallium arsenide; ion implantation; molecular beam epitaxial growth; passivation; power MESFET; surface treatment; GaAs; MBE growth technique; UV-ozone surface treatment; annealing cap; gate-drain breakdown voltage; high power MESFETs; ion-implanted channel layer; passivation layer; planar gate structures; power FETs; undoped surface GaAs layer;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19950070
Filename :
364346
Link To Document :
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