Propagation and coupling characteristics of microstrip lines with laminated ground plane

Author

Kiang, Jean-Fu

Author_Institution

Dept. of Electr. Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan

Volume

44

Issue

2

fYear

1996

fDate

2/1/1996 12:00:00 AM

Firstpage

208

Lastpage

217

Abstract

In this paper, we analyze the effect of laminated ground plane on the propagation and coupling characteristics of microstrip lines. Each lamina is modeled as an anisotropic layer, and transition matrix is used to relate the tangential field components in different laminae. An integral equation is formulated in the spectral domain, and the Galerkin´s method is applied to solve the integral equation for the phase and the attenuation constants of several microstrip line structures. The effects of substrate dielectric are also studied. The attenuation constant variation thus obtained will be useful in circuit board design and in studying signal transmission in lamina environment

Keywords

Galerkin method; dispersion (wave); integral equations; microstrip lines; printed circuit design; spectral-domain analysis; transmission lines; Galerkin´s method; anisotropic layer; attenuation constants; circuit board design; coupling characteristics; integral equation; lamina environment; laminated ground plane; microstrip lines; phase constants; propagation characteristics; signal transmission; spectral domain; substrate dielectric; tangential field components; transition matrix; Anisotropic magnetoresistance; Attenuation; Conductivity; Dielectric substrates; Integral equations; Microstrip; Optical scattering; Optical surface waves; Printed circuits; Transmission line matrix methods;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.481569

Filename

481569