DocumentCode :
1243502
Title :
Improved breakdown of AlInAs/InGaAs heterojunction bipolar transistors
Author :
Fullowan, T.R. ; Pearton, S.J. ; Kopf, R.F. ; Chen, Y.K. ; Chin, M.A. ; Ren, Fengyuan
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Volume :
27
Issue :
25
fYear :
1991
Firstpage :
2340
Lastpage :
2341
Abstract :
AlInAs/InGaAs heterojunction bipolar transistors exhibiting DC breakdown voltages, Vceo, in excess of 7 V are reported. The layer structure uses a two-stage collector to achieve the high breakdown voltages. The devices are fabricated with a triply selfaligned dry etch process with high yield. Respective fT and fmax values of 80 and 60 GHz are obtained for emitter dimensions of 2*4 mu m2. The combination of layer structure design and processing yields AlInAs/InGaAs with both DC and RF characteristics suitable for large-scale, high-speed digital circuit applications.
Keywords :
III-V semiconductors; aluminium compounds; bipolar integrated circuits; electric breakdown of solids; etching; gallium arsenide; heterojunction bipolar transistors; indium compounds; 60 GHz; 7 V; 80 GHz; AlInAs-InGaAs; DC breakdown voltages; HBT; RF characteristics; heterojunction bipolar transistors; high-speed digital circuit applications; layer structure design; triply selfaligned dry etch process; two-stage collector;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19911449
Filename :
121348
Link To Document :
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