DocumentCode :
1244053
Title :
Physics-based simulation of single-event effects
Author :
Dodd, Paul E.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
5
Issue :
3
fYear :
2005
Firstpage :
343
Lastpage :
357
Abstract :
This paper reviews techniques for physics-based device-level simulation of single-event effects (SEEs) in Si microelectronic devices and integrated circuits. Issues for device modeling of SEE are discussed in the context of providing physical insight into mechanisms contributing to SEE as well as providing predictive capabilities for calculation of SEE rates. Recent advances in device simulation methodology are detailed, including full-cell simulations and cross-section calculations from first principles. Examples of the application of physics-based SEE simulations are presented, including scaling trends in soft error sensitivity as predicted by device simulation, single-event latchup (SEL) simulations in CMOS structures, and recent simulations of single-event transient (SET) production and propagation in digital logic circuits.
Keywords :
integrated circuit modelling; integrated circuit reliability; semiconductor device models; semiconductor device reliability; CMOS structures; Si; cross section calculations; device level simulation; device modeling; digital logic circuits; full cell simulations; integrated circuit reliability; integrated circuit testing; integrated circuits; microelectronic devices; radiation effects; radiation hardening; single event effects; single event latchup simulations; single event transient production; soft error sensitivity; Circuit simulation; Discrete event simulation; Integrated circuit modeling; Ionization; Ionizing radiation; Logic circuits; Microelectronics; Predictive models; Radiation effects; Single event upset; Device modeling and simulation; integrated circuit reliability; integrated circuit scaling; integrated circuit testing; radiation effects; radiation hardening (electronics); radiation response; single event effects; single event latchup; single event transient; single event upset; soft errors;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2005.855826
Filename :
1545895
Link To Document :
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