• DocumentCode
    1244126
  • Title

    Reliability aspects of packaging and integration technology for microfluidic systems

  • Author

    Han, Ki-Ho ; Frazier, A. Bruno

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    5
  • Issue
    3
  • fYear
    2005
  • Firstpage
    452
  • Lastpage
    457
  • Abstract
    This paper presents the reliability aspects of an integrated microfluidic-system-interface (MSI) technology for complex microfluidic systems. MSI technology provided three primary functional interface components: microfluidic interconnects, integrated microvalves, and optical windows. The microfluidic interconnects were designed to facilitate complex micro-to-macro fluid interfacing between the microsystem and the macro world in a single package. The functionality and reliability of the fluid interconnects were tested using standard capillary tubing. The pneumatic microvalves were integrated directly into the microfluidic interface. The valve leak-rate characteristics and the bonding stability between the integrated microfluidic interface and the microfluidic system were tested against the pneumatic-valve pressure. Use of the optical windows in the interface was demonstrated by enabling an on-chip infrared polymerase-chain-reaction (PCR) process. This paper demonstrates the use of MSI technology as a facile and reliable interface/packaging method for a complex microfluidic system.
  • Keywords
    electronics packaging; microfluidics; microvalves; reliability; capillary tubing; integrated microfluidic system interface technology; integrated microvalves; microfluidic interconnects; optical windows; packaging reliability; pneumatic microvalves; polymerase chain reaction process; valve pressure; Bonding; Integrated optics; Microfluidics; Microvalves; Optical devices; Optical interconnections; Optical polymers; Packaging; Testing; Valves; Microfluidic-system-interface (MSI); microvalves; packaging;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.856470
  • Filename
    1545907