DocumentCode :
1244450
Title :
Test planning for modular testing of hierarchical SOCs
Author :
Chakrabarty, Krishnendu ; Iyengar, Vikram ; Krasniewski, Mark D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Volume :
24
Issue :
3
fYear :
2005
fDate :
3/1/2005 12:00:00 AM
Firstpage :
435
Lastpage :
448
Abstract :
Multilevel test access mechanism (TAM) optimization is necessary for modular testing of hierarchical systems-on-chip (SOCs) that contain older-generation SOCs as embedded megacores. We consider the case where these older-generation SOCs are used as hard cores in new SOC designs, and they are delivered to the system integrator as optimized and technology-mapped layouts. We present three hierarchical test planning and TAM optimization flows that exploit recent advances in TAM design for flattened SOC hierarchies. These techniques are based on the reuse of existing TAM architectures within megacores and the optimization of the top-level TAM under the constraints imposed by "TAM-ed" megacores that are delivered either with or without a wrapper. We present a new megacore wrapper-design technique for the latter case. Unlike prior methods that assume flat test hierarchies, the proposed methods are directly applicable to real-world design-transfer models involving hard megacores between the core vendor and the system integrator for hierarchical SOCs. Experimental results are presented for four ITC\´02 SOC test benchmarks that contain megacores.
Keywords :
circuit optimisation; integrated circuit design; integrated circuit testing; system-on-chip; SOC designs; TAM architectures; TAM optimization flows; TAM-ed megacores; design transfer model; flat test hierarchies; hand-off model; hard cores; hierarchical systems-on-chip; megacore wrapper-design; modular testing; multilevel test access mechanism optimization; technology-mapped layouts; test planning; test wrappers; Benchmark testing; Circuit testing; Companies; Constraint optimization; Design optimization; Logic testing; Microelectronics; System testing; System-on-a-chip; Very large scale integration; Design transfer and hand-off model; TAM optimization; hard cores; megacores; test access mechanism (TAM); test wrappers; testing time;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2004.842816
Filename :
1397803
Link To Document :
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