DocumentCode :
1245140
Title :
Hydrogen sensitivity of InP HEMTs with WSiN-based gate stack
Author :
Mertens, Samuel D. ; Alamo, Jesús A del ; Suemitsu, Tetsuya ; Enoki, Takatomo
Volume :
52
Issue :
3
fYear :
2005
fDate :
3/1/2005 12:00:00 AM
Firstpage :
305
Lastpage :
310
Abstract :
We have experimentally investigated the hydrogen sensitivity of InP high-electron mobility transistors (HEMTs) with a WSiN-Ti-Pt-Au gate stack. We have found that exposure to hydrogen produces a shift in the threshold voltage of these devices that is one order of magnitude smaller than published data on conventional Ti-Pt-Au gate HEMTs. We have studied this markedly improved reliability through a set of quasi-two-dimensional mechanical and electrostatic simulations. These showed that there are two main causes for the improvement of the hydrogen sensitivity. First, the separation of the Ti-layer from the semiconductor by a thick WSiN layer significantly reduces the stress in the heterostructure underneath the gate. Additionally, the relatively thinner heterostructure used in this study and the presence of an InP etch-stop layer with a small piezoelectric constant underneath the gate reduces the amount of threshold voltage shift that is caused by the mechanical stress.
Keywords :
III-V semiconductors; gold; high electron mobility transistors; hydrogen; indium compounds; piezoelectricity; platinum; semiconductor device reliability; titanium; tungsten compounds; HEMT; InP; InP etch-stop layer; WSiN-Ti-Pt-Au; WSiN-Ti-Pt-Au gate stack; heterostructure; high-electron mobility transistors; hydrogen sensitivity; mechanical stress; piezoelectric constant; piezoelectric effect; quasi-2D electrostatic simulation; quasi-2D mechanical simulation; reliability; threshold voltage shift; Etching; HEMTs; Hydrogen; Indium phosphide; MODFETs; Stress; Telegraphy; Telephony; Testing; Threshold voltage; High-electron mobility transistors (HEMTs); InP; hydrogen; piezoelectric effect; reliability;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.843871
Filename :
1397978
Link To Document :
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