Title :
A four ASIC MCM-C, design for manufacturability and the next generation silicon
Author :
Fulcher, Ed ; Patil, Sada
Author_Institution :
LSI Logic, Fremont, CA, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
A ceramic MCM was designed and put into volume production. Four identical 15 mm square ASIC devices with 370 bond pads each are wirebonded into a four cavity, co-fired, alumina PGA containing 383 pins. All materials and processes were selected following the design for manufacturability principles in order to minimize risk and insure meeting schedule requirements. The results are smaller size, better electrical performance, and lower cost than four single chip CPGAs
Keywords :
CMOS digital integrated circuits; application specific integrated circuits; integrated circuit interconnections; integrated circuit manufacture; microassembling; multichip modules; thermal analysis; Al2O3; CMOS chips; ceramic MCM; co-fired alumina PGA; design for manufacturability; four ASIC MCM-C; volume production; Application specific integrated circuits; Bonding; Ceramics; Costs; Manufacturing; Packaging; Pins; Silicon; Testing; Workstations;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
