MCM-L product development process for low-cost MCMs

Author

Thompson, Patrick

Author_Institution

Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

9

Lastpage

12

Abstract

System size and cost reduction are often the largest factors for interest in commercial MCMs. Performance improvement is generally of secondary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provide reliable products, the cost of doing so has gained increased importance. A new product introduction (NPI) process for low-cost MCMs has been implemented to rapidly provide cost-effective, reliable MCM solutions for cost-sensitive MCM users. The NPI process is based on three attributes: leverage single chip package (SCP) experience and technology, perform product family qualifications, and use only previously qualified silicon in MCMs. Application of the NPI process to the development and qualification of a 28 mm PQFP (Plastic Quad Flat Pack)-based MCM package is presented in this paper

Keywords

integrated circuit reliability; multichip modules; product development; MCM-L product development process; PQFP-based MCM package; cost reduction; low-cost MCMs; plastic quad flat pack; product family qualifications; qualification testing; Components, packaging, and manufacturing technology; Copper; Costs; Maintenance; Nonhomogeneous media; Plastic packaging; Product development; Qualifications; Resins; Substrates;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365474

Filename

365474